Invention Grant

  • Patent Title: Piezoelectric resonator device and method for manufacturing piezoelectric resonator device
  • Patent Title (中): 压电谐振器装置及其制造方法
  • Application No.: US12675419
    Application Date: 2009-06-30
  • Publication No.: US08212453B2
    Publication Date: 2012-07-03
  • Inventor: Naoki Kohda
  • Applicant: Naoki Kohda
  • Applicant Address: JP Kakogawa-shi
  • Assignee: Daishinku Corporation
  • Current Assignee: Daishinku Corporation
  • Current Assignee Address: JP Kakogawa-shi
  • Agency: Mots Law, PLLC
  • Agent Marvin A. Motsenbocker
  • Priority: JP2008-171091 20080630
  • International Application: PCT/JP2009/061937 WO 20090630
  • International Announcement: WO2010/001885 WO 20100107
  • Main IPC: H01L41/08
  • IPC: H01L41/08
Piezoelectric resonator device and method for manufacturing piezoelectric resonator device
Abstract:
A piezoelectric resonator device is provided with a piezoelectric resonator plate, and first and second sealing members that hermetically seal driving electrodes formed on the piezoelectric resonator plate. The piezoelectric resonator plate and the first sealing member are bonded together with a bonding material, and the piezoelectric resonator plate and the second sealing member are bonded together with a bonding material. Also, a multiple-surface bonding portion and a spread preventing portion are provided in at least either of a bonding area between the piezoelectric resonator plate and the first sealing member and a bonding area between the piezoelectric resonator plate and the second sealing member, the multiple-surface bonding portion allowing a bonding material to be bonded to multiple surfaces of different surface orientations, and the spread preventing portion being located on an outer side of the multiple-surface bonding portion and preventing a bonding region bonded to the bonding material from being enlarged.
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