Invention Grant
- Patent Title: Temperature compensation circuit
- Patent Title (中): 温度补偿电路
-
Application No.: US12686613Application Date: 2010-01-13
-
Publication No.: US08212605B2Publication Date: 2012-07-03
- Inventor: Koji Horie , Minoru Nagata
- Applicant: Koji Horie , Minoru Nagata
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2009-006737 20090115
- Main IPC: H03F3/20
- IPC: H03F3/20 ; G05F3/16 ; H03K17/14

Abstract:
A temperature compensation circuit includes a bias circuit configured to output a bias current having a current value increasing in proportion to an absolute temperature in a low-temperature region in which a temperature is lower than a predetermined temperature, and having a greater current value than the current value proportional to the absolute temperature in a high-temperature region in which the temperature is equal to or greater than the predetermined temperature, and a transistor having a control terminal supplied with the bias current. The bias circuit includes a first current generating circuit configured to generate a first current increasing in proportion to the absolute temperature, a second current generating circuit configured to generate a second current that does not flow in the low-temperature region and flows in the high-temperature region, and a control circuit configured to control the second current and having a connection terminal capable of being connected with an external resistor for adjusting a magnitude of the second current, and is configured to generate a third current by adding the first current to the second current, and output the bias current depending on or equal to the third current.
Public/Granted literature
- US20100176869A1 TEMPERATURE COMPENSATION CIRCUIT Public/Granted day:2010-07-15
Information query
IPC分类: