Invention Grant
- Patent Title: Spatial temporal visual analysis of thermal data
- Patent Title (中): 热量数据的空间时间视觉分析
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Application No.: US12290616Application Date: 2008-10-31
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Publication No.: US08212817B2Publication Date: 2012-07-03
- Inventor: Ming C. Hao , Umeshwar Dayal , Ratnesh Kumar Sharma , Chandrakat Patel
- Applicant: Ming C. Hao , Umeshwar Dayal , Ratnesh Kumar Sharma , Chandrakat Patel
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G06T11/20
- IPC: G06T11/20

Abstract:
Systems, methods, and other embodiments associated with spatial temporal visual analysis of thermal data are described. One example system includes recording a set of temperature data including multiple dimensions of data from a set of sensors attached to racks of computers in a data center. The example system also includes displaying the multiple dimensions of data in a two dimension graphic. The example system also includes performing spatial temporal visual analysis techniques to correlate temperature states, discover thermal exceptions, and so on, in the graphic.
Public/Granted literature
- US20100110076A1 Spatial temporal visual analysis of thermal data Public/Granted day:2010-05-06
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