Invention Grant
- Patent Title: HGA suspension pad barrier for elimination of solder bridging defect
- Patent Title (中): HGA悬挂垫障碍消除焊料桥接缺陷
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Application No.: US11973668Application Date: 2007-10-09
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Publication No.: US08213121B2Publication Date: 2012-07-03
- Inventor: Melvin J. A. Dela Pena , Edmar C. Escober , Sandy E. Joson , Teddy T. Tabarangao
- Applicant: Melvin J. A. Dela Pena , Edmar C. Escober , Sandy E. Joson , Teddy T. Tabarangao
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Main IPC: G11B21/16
- IPC: G11B21/16 ; G11B21/24
Abstract:
A method and apparatus for preventing solder bridging. The method includes providing a substrate layer upon which a solder pad is disposed. The method further includes providing a signal conductive layer within the substrate layer. The method also includes forming a solder pad upon the signal conductive layer. The solder pad has a base surface. The method additionally includes forming a barrier portion above the base surface of the solder pad. The barrier portion is for controlling solder flow during a reflow process.
Public/Granted literature
- US20090091860A1 HGA suspension pad barrier for elimination of solder bridging defect Public/Granted day:2009-04-09
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