Invention Grant
- Patent Title: Bone conduction assembly for communication headsets
- Patent Title (中): 通讯耳机的骨传导组件
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Application No.: US12413000Application Date: 2009-03-27
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Publication No.: US08213645B2Publication Date: 2012-07-03
- Inventor: Ryan P. Rye , Michael C. Aulert
- Applicant: Ryan P. Rye , Michael C. Aulert
- Applicant Address: US IL Libertyville
- Assignee: Motorola Mobility, Inc.
- Current Assignee: Motorola Mobility, Inc.
- Current Assignee Address: US IL Libertyville
- Agency: Patents on Demand, P.A.
- Agent Scott M. Garrett
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04M1/00

Abstract:
A bone conduction assembly can include at least a microphone, an assembly stem, an ear cushion, and a microphone channel. The microphone can include an acoustic-to-electric transducer. The assembly stem can house the microphone and can be shaped for insertion into an ear canal of a user. The ear cushion can have an inner surface surrounding an outer surface of the assembly stem and an outer, contiguous, annular surface configured to maintain contact with an ear canal of a user when worn. The microphone channel can be shaped to channel vibrations resulting from bone conduction from the ear canal through the assembly stem to the microphone. In one embodiment, the bone conduction assembly can include a speaker having a speaker channel that is acoustically isolated from the microphone channel.
Public/Granted literature
- US20100246860A1 BONE CONDUCTION ASSEMBLY FOR COMMUNICATION HEADSET Public/Granted day:2010-09-30
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