Invention Grant
- Patent Title: Headphone
- Patent Title (中): 耳机
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Application No.: US11846282Application Date: 2007-08-28
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Publication No.: US08213665B2Publication Date: 2012-07-03
- Inventor: Keitaro Fujiwara , Naotaka Tsunoda , Yuusuke Oosato
- Applicant: Keitaro Fujiwara , Naotaka Tsunoda , Yuusuke Oosato
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JPP2006-241703 20060906
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A headphone includes a headband and a left housing and a right housing. The left housing and the right housing are mounted to respective ends of the headband through respective hangers. Each housing accommodates a drive unit. Sliders including hollow cylindrical members are mounted to the respective hangers, and are slidably supported at slidably supporting portions at the respective ends of the headband. A cord, disposed between the left and right housings and used to pass drive electric current to the drive unit in one of the housings, is spirally accommodated in the hollow cylindrical members making up the respective sliders so that the cord is capable of being stretched and compressed.
Public/Granted literature
- US20080056525A1 Headphone Public/Granted day:2008-03-06
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