Invention Grant
US08213705B2 Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer
有权
用于精确识别形成在晶片上的阵列区域的护理区域的边缘的方法以及在形成在晶片上的阵列区域中检测到的合并缺陷的方法
- Patent Title: Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer
- Patent Title (中): 用于精确识别形成在晶片上的阵列区域的护理区域的边缘的方法以及在形成在晶片上的阵列区域中检测到的合并缺陷的方法
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Application No.: US13032577Application Date: 2011-02-22
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Publication No.: US08213705B2Publication Date: 2012-07-03
- Inventor: Chien-Huei (Adam) Chen , Xiaoming Wang , Eugene Shifrin , Tsung-Pao Fang
- Applicant: Chien-Huei (Adam) Chen , Xiaoming Wang , Eugene Shifrin , Tsung-Pao Fang
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Technologies Corp.
- Current Assignee: KLA-Tencor Technologies Corp.
- Current Assignee Address: US CA Milpitas
- Agent Anne Marie Mewherter
- Main IPC: G06K9/62
- IPC: G06K9/62
Abstract:
Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.
Public/Granted literature
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