Invention Grant
- Patent Title: Structure for an apparatus for monitoring and controlling heat generation in a multi-core processor
- Patent Title (中): 用于在多核处理器中监测和控制发热的装置的结构
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Application No.: US12347947Application Date: 2008-12-31
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Publication No.: US08214660B2Publication Date: 2012-07-03
- Inventor: Louis Bennie Capps, Jr. , Warren D. Dyckman , Michael Jay Shapiro
- Applicant: Louis Bennie Capps, Jr. , Warren D. Dyckman , Michael Jay Shapiro
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Matt Talpis; Mark P Kahler
- Main IPC: G06F1/00
- IPC: G06F1/00 ; G06F15/00 ; G01R15/00 ; G01K1/00 ; G06G7/54

Abstract:
A design structure for a processor may be embodied in a machine readable medium for designing, manufacturing or testing a processor integrated circuit. The design structure may control heat generation in a multi-core processor. The design structure may specify that each processor core includes a temperature sensor that reports temperature information to a processor controller. The design structure may also specify that if a particular processor core exceeds a predetermined temperature, the processor controller disables that processor core to allow that processor core to cool. The design structure may also specify that the processor controller enables the previously disabled processor core when the previously disabled processor core cools sufficiently to a normal operating temperature. In this manner, a multi-core processor may avoid undesirable hot spots that impact processor life.
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