Invention Grant
- Patent Title: Chip mounting system
- Patent Title (中): 芯片安装系统
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Application No.: US12745771Application Date: 2008-12-03
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Publication No.: US08215005B2Publication Date: 2012-07-10
- Inventor: Tsutomu Hiraki
- Applicant: Tsutomu Hiraki
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JPP2007-312093 20071203; JPP2007-312094 20071203
- International Application: PCT/JP2008/072360 WO 20081203
- International Announcement: WO2009/072659 WO 20090611
- Main IPC: H05K13/04
- IPC: H05K13/04

Abstract:
A chip mounting system in which a whole system can be compact including a transfer stage and a tool holding member between a chip feeding section and a substrate holding section. In the chip mounting system, a transfer stage is disposed between a chip feeding stage and a substrate holding stage. A pick-up head and a mounting head are provided movably in a Y-axis direction in which the chip feeding stage and the substrate holding stage are aligned. A movable table which is movable in an X-axis direction, which intersects the Y-axis direction at right angles, is provided in a overwrapping movable region of the chip feeding stage and the substrate holding stage. The transfer stage and a tool holding member, which holds at least one of replacement tools for a pick-up tool and a mounting tool, are provided on the movable table.
Public/Granted literature
- US20100257727A1 CHIP MOUNTING SYSTEM Public/Granted day:2010-10-14
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