Invention Grant
US08215005B2 Chip mounting system 有权
芯片安装系统

  • Patent Title: Chip mounting system
  • Patent Title (中): 芯片安装系统
  • Application No.: US12745771
    Application Date: 2008-12-03
  • Publication No.: US08215005B2
    Publication Date: 2012-07-10
  • Inventor: Tsutomu Hiraki
  • Applicant: Tsutomu Hiraki
  • Applicant Address: JP Osaka
  • Assignee: Panasonic Corporation
  • Current Assignee: Panasonic Corporation
  • Current Assignee Address: JP Osaka
  • Agency: Pearne & Gordon LLP
  • Priority: JPP2007-312093 20071203; JPP2007-312094 20071203
  • International Application: PCT/JP2008/072360 WO 20081203
  • International Announcement: WO2009/072659 WO 20090611
  • Main IPC: H05K13/04
  • IPC: H05K13/04
Chip mounting system
Abstract:
A chip mounting system in which a whole system can be compact including a transfer stage and a tool holding member between a chip feeding section and a substrate holding section. In the chip mounting system, a transfer stage is disposed between a chip feeding stage and a substrate holding stage. A pick-up head and a mounting head are provided movably in a Y-axis direction in which the chip feeding stage and the substrate holding stage are aligned. A movable table which is movable in an X-axis direction, which intersects the Y-axis direction at right angles, is provided in a overwrapping movable region of the chip feeding stage and the substrate holding stage. The transfer stage and a tool holding member, which holds at least one of replacement tools for a pick-up tool and a mounting tool, are provided on the movable table.
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