Invention Grant
- Patent Title: Fluid pressure pump unit
- Patent Title (中): 流体压力泵单元
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Application No.: US12411068Application Date: 2009-03-25
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Publication No.: US08215927B2Publication Date: 2012-07-10
- Inventor: Hideki Niwa , Teruhiko Yoshioka
- Applicant: Hideki Niwa , Teruhiko Yoshioka
- Applicant Address: JP Tokyo
- Assignee: Nabtesco Corporation
- Current Assignee: Nabtesco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Osha • Liang LLP
- Priority: JP2008-080027 20080326
- Main IPC: F04B39/06
- IPC: F04B39/06 ; F04B39/12

Abstract:
The present invention provides a technology for downsizing fluid pressure equipment including a fluid pressure pump and a radiator. The hydraulic pump unit 3 includes: a hydraulic pump 4; a motor 5 which drives the hydraulic pump 4; a cooling fan 7 which is connected to an output shaft 5a of the motor 5 and generates a flow of cooling air 6 to cool the motor 5; and a radiator 8 which receives heat from the hydraulic oil. The motor 5 and the radiator 8 are overlapped with the cooling fan 7, when viewed from the axial direction of the output shaft 5a of the motor 5.
Public/Granted literature
- US20090246044A1 FLUID PRESSURE PUMP UNIT Public/Granted day:2009-10-01
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