Invention Grant
- Patent Title: Contact structure and forming method thereof and connecting structure thereof
- Patent Title (中): 接触结构及其形成方法及其连接结构
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Application No.: US12144658Application Date: 2008-06-24
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Publication No.: US08215969B2Publication Date: 2012-07-10
- Inventor: Sheng-Shu Yang , Shyh-Ming Chang
- Applicant: Sheng-Shu Yang , Shyh-Ming Chang
- Applicant Address: TW Hsinchu TW Taoyuan TW Hsinchu TW New Taipei TW Tainan County TW Hsinchu TW Miao-Li County
- Assignee: Taiwan TFT LCD Association,Chunghwa Picture Tubes, Ltd.,Au Optronics Corporation,Hannstar Display Corporation,Chi Mei Optoelectronics Corporation,Industrial Technology Research Institute,TPO Displays Corp.
- Current Assignee: Taiwan TFT LCD Association,Chunghwa Picture Tubes, Ltd.,Au Optronics Corporation,Hannstar Display Corporation,Chi Mei Optoelectronics Corporation,Industrial Technology Research Institute,TPO Displays Corp.
- Current Assignee Address: TW Hsinchu TW Taoyuan TW Hsinchu TW New Taipei TW Tainan County TW Hsinchu TW Miao-Li County
- Agency: Jianq Chyun IP Office
- Priority: TW97111020A 20080327
- Main IPC: H01R4/58
- IPC: H01R4/58
Abstract:
A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.
Public/Granted literature
- US20090246988A1 CONTACT STRUCTURE AND FORMING METHOD THEREOF AND CONNECTING STRUCTURE THEREOF Public/Granted day:2009-10-01
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