A cutting step of forming a crack (C) above at least one side of a sealant (15) surrounding each display region (D) in each of outer surfaces of a first mother substrate (20) and a second mother substrate (10) of a bonded body (30), and cutting the bonded body (30) into sections including the display regions (D) includes: a first mother substrate cutting step of forming a crack (C) above the sealant (15) surrounding each display region (D) in the outer surface of the first mother substrate (20), and then causing the crack (C) to develop in a substrate thickness direction to cut the first mother substrate (20) into sections including the display regions (D); a residual stress reducing step of reducing a residual stress of the sealant (15) in the bonded body (30) in which the first mother substrate (20) has been cut; and a second mother substrate cutting step of forming a crack (C) above the sealant (15) surrounding each display region (D) in the outer surface of the second mother substrate (10) of the bonded body (30) in which the residual stress of the sealant (15) has been reduced, and then causing the crack (C) to develop in the substrate thickness direction to cut the second mother substrate (10) into sections including the display regions (D).