There is provided a method for exchanging an atmosphere of a vacuum chamber of a processing apparatus configured to process a substrate under a vacuum environment. The method includes the steps of holding the substrate using a holding unit provided in the vacuum chamber, and exchanging the atmosphere of the vacuum chamber through exhaustion or air supply, wherein the exchanging step maintains a pressure of the vacuum chamber in a range between 10 Pa and 10000 Pa for a period between 10 seconds and 600 seconds while controlling a temperature of a dust collection unit provided in the vacuum chamber lower than a temperature of the substrate.