There are provided a film forming equipment component having a structure in which an deposited film d formed on the component can be separated from the component for a time period shorter than the prior art to reduce damage due to a cleaning fluid S, and a method of cleaning such a component. A metal film layer 2 electrochemically less noble than the matrix metal material 1 of the aforementioned component is formed on the surface of the matrix metal material 1 through thermal spraying, vapor depositing, sputtering, laminating or other process. Alternatively, a second metal film layer 3 electrochemically more noble than the aforementioned matrix metal material 1 is formed on the surface of the metal film layer 2 through said thermal spraying or other process. Thus, a local cell is formed between the metal film layer 2 and the matrix metal material 1 or the second metal film layer 3. Therefore, the deposited film d can be separated from the matrix metal material 1 for an extremely shortened time period, without damaging the matrix metal material 1 itself from the cleaning fluid S.