Invention Grant
US08216668B2 Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device
有权
树脂组合物，具有基材的绝缘片，预浸料，多层印刷线路板和半导体器件
- Patent Title: Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device
- Patent Title (中): 树脂组合物，具有基材的绝缘片，预浸料，多层印刷线路板和半导体器件
-
Application No.: US12443822Application Date: 2007-10-02
-
Publication No.: US08216668B2Publication Date: 2012-07-10
- Inventor: Michio Kimura
- Applicant: Michio Kimura
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Company, Ltd.
- Current Assignee: Sumitomo Bakelite Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2006-274666 20061006
- International Application: PCT/JP2007/069303 WO 20071002
- International Announcement: WO2008/044552 WO 20080417
- Main IPC: B32B3/00
- IPC: B32B3/00
Abstract:
The present invention provides a resin composition which can produce a multilayer printed wiring board not causing peeling and crack in a thermal shock test such as a cooling/heating cycle, and having high heat resistance and low-thermal expansion characteristics, when the resin composition is used for an insulating layer of the multilayer printed wiring board; and also an insulating sheet provided on a base, a prepreg, a multilayer printed wiring board and a semiconductor device using thereof. The resin composition is used for forming an insulating layer of the multilayer printed wiring board, wherein a surface roughness parameter Rvk value of the insulating layer is from 0.1 μm to 0.8 μm, measured after the insulating layer being formed with the resin composition, and subject to roughening treatment.
Public/Granted literature
Information query
