Invention Grant
- Patent Title: Structured resin systems with high thermal conductivity fillers
- Patent Title (中): 具有高导热性填料的结构树脂体系
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Application No.: US11152984Application Date: 2005-06-14
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Publication No.: US08216672B2Publication Date: 2012-07-10
- Inventor: James David Blackhall Smith , Gary Stevens , John William Wood
- Applicant: James David Blackhall Smith , Gary Stevens , John William Wood
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: B32B7/12
- IPC: B32B7/12 ; H01L23/24
Abstract:
In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler 30. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal 40 polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids 60.
Public/Granted literature
- US20050277351A1 Structured resin systems with high thermal conductivity fillers Public/Granted day:2005-12-15
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