Invention Grant
US08216863B2 Method for producing a field-emitter array with controlled apex sharpness 有权
制造具有受控顶尖锐度的场发射器阵列的方法

  • Patent Title: Method for producing a field-emitter array with controlled apex sharpness
  • Patent Title (中): 制造具有受控顶尖锐度的场发射器阵列的方法
  • Application No.: US13001449
    Application Date: 2009-05-29
  • Publication No.: US08216863B2
    Publication Date: 2012-07-10
  • Inventor: Eugenie KirkSoichiro Tsujino
  • Applicant: Eugenie KirkSoichiro Tsujino
  • Applicant Address: CH Villigen PSI
  • Assignee: Paul Scherrer Insitut
  • Current Assignee: Paul Scherrer Insitut
  • Current Assignee Address: CH Villigen PSI
  • Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
  • Priority: EP08011691 20080627
  • International Application: PCT/EP2009/056595 WO 20090529
  • International Announcement: WO2009/156242 WO 20091230
  • Main IPC: H01L21/00
  • IPC: H01L21/00 H01L21/331
Method for producing a field-emitter array with controlled apex sharpness
Abstract:
A method of manufacturing field-emitter arrays by a molding technique includes uniformly controlling a shape of mold holes to obtain field emitter tips having diameters below 100 nm and blunted side edges. Repeated oxidation and etching of a mold substrate formed of single-crystal semiconductor mold wafers is carried out, wherein the mold holes for individual emitters are fabricated by utilizing the crystal orientation dependence of the etching rate.
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