Invention Grant
- Patent Title: Methods and devices for manufacturing cantilever leads in a semiconductor package
- Patent Title (中): 在半导体封装中制造悬臂引线的方法和装置
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Application No.: US12581326Application Date: 2009-10-19
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Publication No.: US08216885B2Publication Date: 2012-07-10
- Inventor: Jeffrey Gail Holloway
- Applicant: Jeffrey Gail Holloway
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method of manufacturing a semiconductor package includes providing a metallic leadframe having a plurality of cantilever leads and a mounting area for mounting a die, and disposing one or more non-conductive supports adjacent to a recessed surface of the cantilever leads to support the leads during die mount, wire bond, and encapsulation processes. The method further includes mounting the die in the mounting area and electrically connecting the die to the cantilever leads, and then encapsulating at least a portion of the die, the leadframe, and the supports with an encapsulant.
Public/Granted literature
- US20110089547A1 METHODS AND DEVICES FOR MANUFACTURING CANTILEVER LEADS IN A SEMICONDUCTOR PACKAGE Public/Granted day:2011-04-21
Information query
IPC分类:
