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US08216899B2 Flash memory device and method manufacturing the same 有权
闪存设备和制造方法相同

Flash memory device and method manufacturing the same
Abstract:
According to the present disclosure, a flash memory device includes a semiconductor substrate that includes selection transistor regions and a memory cell region defined between the selection transistor region, first isolation layers formed in the selection transistor regions, and second isolation layers formed in the memory cell region. The second isolation layers have a lower height than the first isolation layers.
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