Invention Grant
- Patent Title: Taphole fill material and method for manufacturing the same
- Patent Title (中): 钻孔填充材料及其制造方法
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Application No.: US13288119Application Date: 2011-11-03
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Publication No.: US08216954B2Publication Date: 2012-07-10
- Inventor: Thomas M. Dunn
- Applicant: Thomas M. Dunn
- Applicant Address: US MI Detroit US TX Hilltop Lakes
- Assignee: Edw. C. Levy Co.,Melt Solutions, L.L.C.
- Current Assignee: Edw. C. Levy Co.,Melt Solutions, L.L.C.
- Current Assignee Address: US MI Detroit US TX Hilltop Lakes
- Agency: Honigman Miller Schwartz and Cohn LLP
- Main IPC: C21C5/00
- IPC: C21C5/00
Abstract:
A high-temperature, heat-resistant fill material is disclosed. The high-temperature, heat-resistant fill material includes an alumina refractory waste material having one or more of a used alumina-magnesium-carbon material, a used high-alumina material and a used fused-grain alumina material is disclosed. A method for method for manufacturing a material is also disclosed.
Public/Granted literature
- US20120046155A1 Taphole Fill Material and Method for Manufacturing the Same Public/Granted day:2012-02-23
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