Invention Grant
US08217441B2 Semiconductor constructions including gate arrays formed on partial SOI substrate
有权
包括在部分SOI衬底上形成的栅极阵列的半导体结构
- Patent Title: Semiconductor constructions including gate arrays formed on partial SOI substrate
- Patent Title (中): 包括在部分SOI衬底上形成的栅极阵列的半导体结构
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Application No.: US12186726Application Date: 2008-08-06
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Publication No.: US08217441B2Publication Date: 2012-07-10
- Inventor: Mark Fischer
- Applicant: Mark Fischer
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John.P.S.
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/94 ; H01L21/336

Abstract:
The invention includes methods for utilizing partial silicon-on-insulator (SOI) technology in combination with fin field effect transistor (finFET) technology to form transistors particularly suitable for utilization in dynamic random access memory (DRAM) arrays. The invention also includes DRAM arrays having low rates of refresh. Additionally, the invention includes semiconductor constructions containing transistors with horizontally-opposing source/drain regions and channel regions between the source/drain regions. The transistors can include gates that encircle at least three-fourths of at least portions of the channel regions, and in some aspects can include gates that encircle substantially an entirety of at least portions of the channel regions.
Public/Granted literature
- US20090194802A1 Semiconductor Constructions, and DRAM Arrays Public/Granted day:2009-08-06
Information query
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