Invention Grant
US08217454B2 Semiconductor device 有权
半导体器件

  • Patent Title: Semiconductor device
  • Patent Title (中): 半导体器件
  • Application No.: US13025176
    Application Date: 2011-02-11
  • Publication No.: US08217454B2
    Publication Date: 2012-07-10
  • Inventor: Wei-Chieh Lin
  • Applicant: Wei-Chieh Lin
  • Applicant Address: TW Hsinchu Science Park, Hsinchu
  • Assignee: Sinopower Semiconductor Inc.
  • Current Assignee: Sinopower Semiconductor Inc.
  • Current Assignee Address: TW Hsinchu Science Park, Hsinchu
  • Agent Winston Hsu; Scott Margo
  • Priority: TW99140177A 20101122
  • Main IPC: H01L29/66
  • IPC: H01L29/66
Semiconductor device
Abstract:
A semiconductor device includes an epitaxial layer having a first conductive type, and at least one first semiconductor layer and a second semiconductor layer having a second conductive type. The first semiconductor layer is disposed in the epitaxial layer of a peripheral region, and has an arc portion, and a first strip portion and a second strip portion extended from two ends of the arc portion. The first strip portion points to an active device region, and the second strip portion is perpendicular to the first strip portion The second semiconductor layer is disposed in the epitaxial layer of the peripheral region between the active device region and the second strip portion, and the second semiconductor has a sidewall facing and parallel to the first semiconductor layer.
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