Invention Grant
- Patent Title: High-speed semiconductor device and method for manufacturing the same
- Patent Title (中): 高速半导体器件及其制造方法
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Application No.: US11990491Application Date: 2006-08-01
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Publication No.: US08217466B2Publication Date: 2012-07-10
- Inventor: Kanji Otsuka , Fumio Mizuno , Munekazu Takano , Tamotsu Usami
- Applicant: Kanji Otsuka , Fumio Mizuno , Munekazu Takano , Tamotsu Usami
- Applicant Address: JP Kanagawa
- Assignee: Jjtech Co., Ltd.
- Current Assignee: Jjtech Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Wenderoth, Lind & Ponack, LLP
- Priority: JP2005-237253 20050818
- International Application: PCT/JP2006/315221 WO 20060801
- International Announcement: WO2007/020796 WO 20070222
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
Disclosed is a semiconductor device wherein the switching speed of a transistor is increased. Specifically disclosed is a semiconductor device comprising a semiconductor layer formed on a part of an insulating layer, a first transistor formed on a lateral face of the semiconductor layer and having a first gate insulating film, a first gate electrode and two first impurity layers forming a source and a drain, and a second transistor formed on another lateral face of the semiconductor layer and having a second gate insulating film, a second gate electrode and two second impurity layers forming a source and a drain.
Public/Granted literature
- US20090096029A1 Semiconductor Device and Manufacturing Method Thereof Public/Granted day:2009-04-16
Information query
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