Invention Grant
- Patent Title: Micro electro-mechanical system packaging and interconnect
- Patent Title (中): 微机电系统封装和互连
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Application No.: US11192945Application Date: 2005-07-29
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Publication No.: US08217473B2Publication Date: 2012-07-10
- Inventor: Chien-Hua Chen , John Bamber , Henry Kang
- Applicant: Chien-Hua Chen , John Bamber , Henry Kang
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L27/14
- IPC: H01L27/14
Abstract:
A micro electro-mechanical system (MEMS) device includes an electrical wafer, a mechanical wafer, a plasma treated oxide seal bonding the electrical wafer to the mechanical wafer, and an electrical interconnect between the electrical wafer and the mechanical wafer.
Public/Granted literature
- US20070128828A1 Micro electro-mechanical system packaging and interconnect Public/Granted day:2007-06-07
Information query
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