Invention Grant
US08217505B2 Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same
有权
在引线框架上包括嵌入式柔性电路的封装IC器件及其制造方法
- Patent Title: Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same
- Patent Title (中): 在引线框架上包括嵌入式柔性电路的封装IC器件及其制造方法
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Application No.: US12875028Application Date: 2010-09-02
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Publication No.: US08217505B2Publication Date: 2012-07-10
- Inventor: Choo Kuan Lee , Chin Hui Chong , David J. Corisis
- Applicant: Choo Kuan Lee , Chin Hui Chong , David J. Corisis
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A device is disclosed which includes a flexible material including at least one conductive wiring trace, a first die including at least an integrated circuit, the first die being positioned above a portion of the flexible material, and an encapsulant material that covers the first die and at least a portion of the flexible material. A method is disclosed which includes positioning a first die above a portion of a flexible material, the first die including an integrated circuit and the flexible material including at least one conductive wiring trace, and forming an encapsulant material that covers the first die and at least a portion of the flexible material, wherein at least a portion of the flexible material extends beyond the encapsulant material.
Public/Granted literature
- US20100320578A1 PACKAGED IC DEVICE COMPRISING AN EMBEDDED FLEX CIRCUIT, AND METHODS OF MAKING THE SAME Public/Granted day:2010-12-23
Information query
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