Invention Grant
- Patent Title: Thermal interface device
- Patent Title (中): 热接口设备
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Application No.: US11526327Application Date: 2006-09-25
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Publication No.: US08217512B1Publication Date: 2012-07-10
- Inventor: Gary Carlson , Frank Landon , Jeffrey Chen , Mark Minot , Joseph Talbert
- Applicant: Gary Carlson , Frank Landon , Jeffrey Chen , Mark Minot , Joseph Talbert
- Applicant Address: US CA Irvine
- Assignee: EADS North America, Inc.
- Current Assignee: EADS North America, Inc.
- Current Assignee Address: US CA Irvine
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A thermal interface device (100) includes a base member (102) and a pocket (104) which is filled with a thermally conductive material or medium such as diamond dust suspended in a solvent such as propylene glycol or a thermally conductive material such as thermally conductive rubber. The pocket (104) is hermitically sealed to the base member (102) in order to keep the thermally conductive material within the pocket. The filled pocket (104) forms a deformable “pillow” having a high thermal conductance. The deformable pocket (104) can contour to the shape of a device it is pressed against such as an electronic device undergoing testing.
Information query
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