Invention Grant
- Patent Title: Dual-band antenna assembly
- Patent Title (中): 双频天线组合
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Application No.: US12627014Application Date: 2009-11-30
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Publication No.: US08217840B2Publication Date: 2012-07-10
- Inventor: Min Chen , Cho-Ju Chung
- Applicant: Min Chen , Cho-Ju Chung
- Applicant Address: CN Shanghai TW Tu-Cheng, New Taipei
- Assignee: Ambit Microsystems (Shanghai) Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Ambit Microsystems (Shanghai) Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shanghai TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200920308926U 20090826
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
A dual-band antenna assembly is positioned on a substrate, and includes an insulation body, a plane antenna and a microstrip antenna. The insulation body includes a plane surface paralleled to the substrate, and a side surface perpendicularly extending from edges of the plane surface to the substrate. The plane antenna includes a first feed portion and a first radiator. The first feed portion passes through the substrate to the plane surface of the insulation body. The first radiator is substantially positioned on a center of the plane surface of the insulation body, and electrically connected to the first feed portion. The microstrip antenna includes a second feed portion and a second radiator. The second radiator is a microstrip, electrically connected to the second feed portion and positioned on the side surface of the insulation body.
Public/Granted literature
- US20110050538A1 DUAL-BAND ANTENNA ASSEMBLY Public/Granted day:2011-03-03
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