Invention Grant
US08218129B2 Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, measuring method, and position measurement system 有权
移动体驱动方法和移动体驱动系统,图案形成方法和装置,曝光方法和装置,装置制造方法,测量方法和位置测量系统

  • Patent Title: Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, measuring method, and position measurement system
  • Patent Title (中): 移动体驱动方法和移动体驱动系统,图案形成方法和装置,曝光方法和装置,装置制造方法,测量方法和位置测量系统
  • Application No.: US12195923
    Application Date: 2008-08-21
  • Publication No.: US08218129B2
    Publication Date: 2012-07-10
  • Inventor: Yuichi ShibazakiYuho Kanaya
  • Applicant: Yuichi ShibazakiYuho Kanaya
  • Applicant Address: JP Tokyo
  • Assignee: Nikon Corporation
  • Current Assignee: Nikon Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Oliff & Berridge, PLC
  • Main IPC: G03B27/58
  • IPC: G03B27/58 G03B27/42
Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, measuring method, and position measurement system
Abstract:
By moving a wafer stage while monitoring an XY position of a wafer stage WST using an interferometer system, and scanning a Y scale in an X-axis direction and a Y-axis direction using a surface position sensor, an XY setting position of the surface position sensor is measured. Based on information of the setting position obtained, by measuring a position coordinate of the wafer stage in a perpendicular direction with respect to an XY plane and a tilt direction, the wafer stage is driven in a stable manner and with high precision.
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