Invention Grant
- Patent Title: Support structure for MEMS device and methods therefor
- Patent Title (中): MEMS器件的支撑结构及其方法
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Application No.: US12711634Application Date: 2010-02-24
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Publication No.: US08218229B2Publication Date: 2012-07-10
- Inventor: Teruo Sasagawa , Clarence Chui , Manish Kothari , SuryaPrakash Ganti , Jeffrey B. Sampsell , Chun-Ming Wang
- Applicant: Teruo Sasagawa , Clarence Chui , Manish Kothari , SuryaPrakash Ganti , Jeffrey B. Sampsell , Chun-Ming Wang
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G02B26/08
Abstract:
A microelectromechanical systems device having support structures formed of sacrificial material surrounded by a protective material. The microelectromechanical systems device includes a substrate having an electrode formed thereon. Another electrode is separated from the first electrode by a cavity and forms a movable layer, which is supported by support structures formed of a sacrificial material.
Public/Granted literature
- US20100147790A1 SUPPORT STRUCTURE FOR MEMS DEVICE AND METHODS THEREFOR Public/Granted day:2010-06-17
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