Invention Grant
- Patent Title: Electronic device, electronic component, and method of manufacturing electronic device
- Patent Title (中): 电子装置,电子部件以及电子装置的制造方法
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Application No.: US12536394Application Date: 2009-08-05
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Publication No.: US08218327B2Publication Date: 2012-07-10
- Inventor: Kiyokazu Ishizaki
- Applicant: Kiyokazu Ishizaki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2008-305182 20081128
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
According to one embodiment, an electronic device includes an electronic component and a circuit board. The electronic component includes a metal material. The circuit board includes a first surface on which the electronic component is mounted and a second surface opposite the first surface. The electronic component includes a contact surface configured to be in contact with the first surface, and is configured to have the center of gravity at a location displaced from the center of the contact surface. The electronic component is temporarily fixed by a magnetic force that attracts the metal material from the second surface with the contact surface being in contact with the first surface.
Public/Granted literature
- US20100165590A1 ELECTRONIC DEVICE, ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2010-07-01
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