Invention Grant
US08218327B2 Electronic device, electronic component, and method of manufacturing electronic device 有权
电子装置,电子部件以及电子装置的制造方法

Electronic device, electronic component, and method of manufacturing electronic device
Abstract:
According to one embodiment, an electronic device includes an electronic component and a circuit board. The electronic component includes a metal material. The circuit board includes a first surface on which the electronic component is mounted and a second surface opposite the first surface. The electronic component includes a contact surface configured to be in contact with the first surface, and is configured to have the center of gravity at a location displaced from the center of the contact surface. The electronic component is temporarily fixed by a magnetic force that attracts the metal material from the second surface with the contact surface being in contact with the first surface.
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