Invention Grant
- Patent Title: Electronic component module
- Patent Title (中): 电子元件模块
-
Application No.: US12730474Application Date: 2010-03-24
-
Publication No.: US08218331B2Publication Date: 2012-07-10
- Inventor: Hirotada Furukawa , Mitsuru Ishibashi
- Applicant: Hirotada Furukawa , Mitsuru Ishibashi
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2009-076586 20090326
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K7/00 ; H01L23/48

Abstract:
In a DC-DC converter module, a first through-hole conductor provided in a substrate as a first lead for electrically connecting a terminal as a voltage output terminal of an IC and a first terminal of an inductor component to each other and a second through-hole conductor provided in the substrate as a second lead for electrically connecting a terminal as a switching terminal of the IC and a second terminal of the inductor component to each other oppose each other in a direction intersecting a direction in which the first and second terminals oppose each other in the inductor component (i.e., the longitudinal direction of the substrate and inductor component).
Public/Granted literature
- US20100246151A1 ELECTRONIC COMPONENT MODULE Public/Granted day:2010-09-30
Information query