Invention Grant
US08218917B2 Package manufacturing method, package, optical module and die for integral molding
失效
封装制造方法，封装，光学模块和模具一体成型
- Patent Title: Package manufacturing method, package, optical module and die for integral molding
- Patent Title (中): 封装制造方法，封装，光学模块和模具一体成型
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Application No.: US12530247Application Date: 2008-03-07
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Publication No.: US08218917B2Publication Date: 2012-07-10
- Inventor: Akihiko Sano , Hiroto Nozawa , Naru Yasuda , Hayami Hosokawa
- Applicant: Akihiko Sano , Hiroto Nozawa , Naru Yasuda , Hayami Hosokawa
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Osha • Liang LLP
- Priority: JP2007-061044 20070309
- International Application: PCT/JP2008/054188 WO 20080307
- International Announcement: WO2008/111524 WO 20080918
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/255 ; B28B23/18
Abstract:
An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.
Public/Granted literature
- US20100104240A1 PACKAGE MANUFACTURING METHOD, PACKAGE, OPTICAL MODULE AND DIE FOR INTEGRAL MOLDING Public/Granted day:2010-04-29
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