Invention Grant
- Patent Title: Cover flip mechanism and electronic device using the same
- Patent Title (中): 盖翻盖机构和使用其的电子设备
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Application No.: US12216010Application Date: 2008-06-27
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Publication No.: US08219159B2Publication Date: 2012-07-10
- Inventor: Chin-Chung Lai , Hung-Chang Hung
- Applicant: Chin-Chung Lai , Hung-Chang Hung
- Applicant Address: TW Taipei
- Assignee: Asustek Computer Inc.
- Current Assignee: Asustek Computer Inc.
- Current Assignee Address: TW Taipei
- Agency: Bacon & Thomas, PLLC
- Priority: TW96124379A 20070704
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
A cover flip mechanism and an electronic device using the same are provided. An electronic device with the cover flip mechanism includes a first casing and a second casing. The cover flip mechanism includes a sliding mechanism connected to the first casing and the second casing, a rotating mechanism having a supporting portion and a rotating portion disposed at the second casing and is connected to the supporting portion, a fastener pivotally connected to the second casing and a protrudent block disposed at the first casing. When the first casing slides relatively to the second casing to the rotating location, the protrudent block pushes the fastener, and then the fastener rotates and releases the supporting portion. Therefore, the supporting portion can rotate relatively to the second casing via the rotating portion further to push the first casing to rotate relatively to the second casing.
Public/Granted literature
- US20090009949A1 Cover flip mechanism and electronic device using the same Public/Granted day:2009-01-08
Information query