Invention Grant
US08219329B2 Thermal type mass flow meter, and thermal type mass flow control device
有权
热式质量流量计,热式质量流量控制装置
- Patent Title: Thermal type mass flow meter, and thermal type mass flow control device
- Patent Title (中): 热式质量流量计,热式质量流量控制装置
-
Application No.: US12295037Application Date: 2007-05-23
-
Publication No.: US08219329B2Publication Date: 2012-07-10
- Inventor: Hiroyuki Ebi , Tetsuo Shimizu , Hitoshi Kitagawa , Shuji Moriya , Tsuneyuki Okabe
- Applicant: Hiroyuki Ebi , Tetsuo Shimizu , Hitoshi Kitagawa , Shuji Moriya , Tsuneyuki Okabe
- Applicant Address: JP Kyoto
- Assignee: HORIBA STEC, Co., Ltd.
- Current Assignee: HORIBA STEC, Co., Ltd.
- Current Assignee Address: JP Kyoto
- Priority: JP2006-146512 20060526
- International Application: PCT/JP2007/060484 WO 20070523
- International Announcement: WO2007/138941 WO 20071206
- Main IPC: G01F1/00
- IPC: G01F1/00 ; G01F1/12

Abstract:
A thermal mass flow meter and a thermal mass flow control device addresses a thermal siphon error, even if they are in a compact and inexpensive structure, without using a flow path converting block. A control computing process portion is configured to correct a measurement error caused by thermal siphon by calculating a correction value based on a measurement value at time of depressurizing fluid flow path and flow rate measuring conduit to an atmospheric pressure or less, a difference between the measurement value and a measurement value at time of charging an actual fluid into the flow rate measuring conduit, kind of the actual fluid, pressure at time of charging the actual fluid, and flow ratio of the fluid flowing in the fluid flow path and the flow rate measuring conduit, storing the correction value, and correcting an actual measured output flow value by the stored correction value.
Public/Granted literature
- US20110125445A1 THERMAL TYPE MASS FLOW METER, AND THERMAL TYPE MASS FLOW CONTROL DEVICE Public/Granted day:2011-05-26
Information query