Invention Grant
US08219697B2 Diameter protocol and SH interface support for SIP server architecture
有权
Diameter协议和SH接口支持SIP服务器架构
- Patent Title: Diameter protocol and SH interface support for SIP server architecture
- Patent Title (中): Diameter协议和SH接口支持SIP服务器架构
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Application No.: US11750261Application Date: 2007-05-17
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Publication No.: US08219697B2Publication Date: 2012-07-10
- Inventor: Anno R. Langen , David Connelly , Rao Nasir Khan , Ioannis Cosmadopoulos , Jaroslaw Wilkiewicz
- Applicant: Anno R. Langen , David Connelly , Rao Nasir Khan , Ioannis Cosmadopoulos , Jaroslaw Wilkiewicz
- Applicant Address: US CA Redwood Shores
- Assignee: Oracle International Corporation
- Current Assignee: Oracle International Corporation
- Current Assignee Address: US CA Redwood Shores
- Agency: Fliesler Meyer LLP
- Main IPC: G06F15/16
- IPC: G06F15/16 ; G06F15/167 ; G06F15/177 ; G06F15/173 ; G06F9/00 ; G06F9/44 ; G06F9/46 ; G06F13/00
Abstract:
A SIP server can be distributed over a cluster network and handle the processing of various SIP communications. A Diameter protocol web application can be deployed on the engine tier of the SIP server for enabling communication between the SIP server and an HSS. A profile service API can be provided that allows applications running on the SIP server to access user profile data stored on the HSS. The applications can also be allowed to subscribe to notifications about changes to the user profile data on the HSS. An Sh interface provider can be deployed on the SIP server for generating and responding to Diameter command codes. SIP servlets can access the user profile data in the form of an XML document.
Public/Granted literature
- US20080127232A1 Diameter Protocol and SH Interface Support for SIP Server Architecture Public/Granted day:2008-05-29
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