Invention Grant
US08220133B2 Method for attaching a cable to the housing of an electronic circuit 有权
将电缆连接到电子电路的外壳的方法

  • Patent Title: Method for attaching a cable to the housing of an electronic circuit
  • Patent Title (中): 将电缆连接到电子电路的外壳的方法
  • Application No.: US12594033
    Application Date: 2008-04-14
  • Publication No.: US08220133B2
    Publication Date: 2012-07-17
  • Inventor: Frédéric Girard
  • Applicant: Frédéric Girard
  • Applicant Address: FR
  • Assignee: E2V Semiconductors
  • Current Assignee: E2V Semiconductors
  • Current Assignee Address: FR
  • Agency: Lowe Hauptman Ham & Berner, LLP
  • Priority: FR0702780 20070417
  • International Application: PCT/EP2008/054475 WO 20080414
  • International Announcement: WO2008/135342 WO 20081113
  • Main IPC: B23P19/02
  • IPC: B23P19/02
Method for attaching a cable to the housing of an electronic circuit
Abstract:
The invention relates to the attachment of a multiple-conductor electronic cable to an electronic circuit in a sealed housing. The cable is placed in a sheath of a heat-deformable material and the method comprises the following steps: placing a rigid bushing (40) with a protruding collar (48) on the exposed end of the cable, heating the end in a conical mold or softening the sheath, inserting the bushing between the cable conductors and the softened sheath, the collar of the bushing pushing the sheath material until the conical portion of the mold is filled, cooling the sheath for solidifying it, extracting the end of the cable from the mold, the end having a conical portion with an increasing diameter ending with the protruding collar, inserting the cable in the housing opening from the inside before closing the housing. The invention can be used or an intra-oral dental radiology sensor.
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