Invention Grant
- Patent Title: Method for improving an Electromagnetic bandgap structure
- Patent Title (中): 改进电磁带隙结构的方法
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Application No.: US12273519Application Date: 2008-11-18
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Publication No.: US08220144B2Publication Date: 2012-07-17
- Inventor: Chia-Hsing Chou , Chih-Wei Tsai
- Applicant: Chia-Hsing Chou , Chih-Wei Tsai
- Applicant Address: TW Taipei
- Assignee: ASUSTeK Computer Inc.
- Current Assignee: ASUSTeK Computer Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW96144976A 20071127
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
A method for improving EBG (electromagnetic bandgap) structures is provided. First, a multi-layer board having at least one EBG unit is provided. Then, a maximum input impedance of the EBG unit under a predetermined frequency band is measured, in which a frequency corresponding to the maximum input impedance is a resonance frequency, and a capacitance is determined based on the resonance frequency. Besides, a minimum input impedance of the EBG unit is measured, and a logarithmic value corresponding to the maximum input impedance and a logarithmic value corresponding to the minimum input impedance are obtained so as to determine a resistance. Finally, an electronic device having the capacitance and the resistance is coupled to the EBG unit in parallel.
Public/Granted literature
- US20090135570A1 METHOD FOR IMPROVING EBG STRUCTURES AND MULTI-LAYER BOARD APPLYING THE SAME Public/Granted day:2009-05-28
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