Invention Grant
- Patent Title: Low thermal mass semiconductor wafer plate
- Patent Title (中): 低热量半导体晶片板
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Application No.: US13232676Application Date: 2011-09-14
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Publication No.: US08220646B2Publication Date: 2012-07-17
- Inventor: Brian Lawrence Gilmore , Lance G. Hellwig
- Applicant: Brian Lawrence Gilmore , Lance G. Hellwig
- Applicant Address: US MO St. Peters
- Assignee: MEMC Electronic Materials, Inc.
- Current Assignee: MEMC Electronic Materials, Inc.
- Current Assignee Address: US MO St. Peters
- Agency: Armstrong Teasdale, LLP
- Main IPC: A47G19/08
- IPC: A47G19/08
Abstract:
A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.
Public/Granted literature
- US20120074081A1 Low Thermal Mass Semiconductor Wafer Plate Public/Granted day:2012-03-29
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