Disclosed is a method for bonding stainless steel to aluminum oxide. The method includes the steps of providing a first substrate of the stainless steel, filling solder in the first substrate, providing a second substrate of the aluminum oxide, filling solder in the second substrate, providing a net, pressing the net, locating the net between the first and second substrates to form a laminate and clamping the laminate, locating the laminate in a vacuum oven, increasing the temperature in the vacuum oven, retaining the temperature in the vacuum oven, and decreasing the temperature in the vacuum oven.