Invention Grant
- Patent Title: Heat dissipation assembly for an LED downlight
- Patent Title (中): LED筒灯散热组件
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Application No.: US12369582Application Date: 2009-02-11
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Publication No.: US08220970B1Publication Date: 2012-07-17
- Inventor: Aslam Khazi , Ken Czech , Alejandro Mier-Langner
- Applicant: Aslam Khazi , Ken Czech , Alejandro Mier-Langner
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee Address: NL Eindhoven
- Agent John F. Salazar; Mark L. Beloborodov
- Main IPC: F21V29/00
- IPC: F21V29/00

Abstract:
A heat dissipation assembly for an LED downlight, comprises an LED printed circuit board assembly having a first surface, a second surface and a plurality of LEDs on one of the first surface and the second surface, the LED printed circuit board assembly engaging a primary reflector on a second surface, wherein the LED printed circuit board assembly transfer thermal energy in a first mode to the heat sink and in a second mode to the primary reflector.
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