Invention Grant
- Patent Title: Housing comprising a housing underpart and method for emitting electromagnetic radiation
- Patent Title (中): 壳体包括壳体和用于发射电磁辐射的方法
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Application No.: US12198393Application Date: 2008-08-26
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Publication No.: US08220973B2Publication Date: 2012-07-17
- Inventor: Moritz Engl , Florin Oswald
- Applicant: Moritz Engl , Florin Oswald
- Applicant Address: DE Regensburg
- Assignee: Osram Opto Semiconductors GmbH
- Current Assignee: Osram Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Fish & Richardson P.C.
- Priority: DE102007041133 20070830
- Main IPC: F21V5/00
- IPC: F21V5/00
Abstract:
A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed.
Public/Granted literature
- US20090059588A1 HOUSING COMPRISING A HOUSING UNDERPART AND METHOD FOR EMITTING ELECTROMAGNETIC RADIATION Public/Granted day:2009-03-05
Information query
