A lamp assembly manages thermal energy output from solid state lighting elements. An aspect of the present disclosure provides a lamp assembly that achieves enhanced cooling of light elements within the assembly. Enhanced cooling is achieved, in this aspect, by providing a lamp assembly including a heat sink having a plurality of thermo bosses protruding therefrom on a first side, and a plurality of heat sink fins on a second side. A printed circuit board is secured to the first side of the heat sink, and has a plurality of through holes that correspond to the size and locations of the thermo bosses, such that when the printed circuit board is secured to the heat sink, the thermo bosses extend into the through holes.