Invention Grant
- Patent Title: Wireless telemetry electronic circuit package for high temperature environments
- Patent Title (中): 无线遥测电子电路封装,适用于高温环境
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Application No.: US12192280Application Date: 2008-08-15
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Publication No.: US08220990B2Publication Date: 2012-07-17
- Inventor: David J. Mitchell , Anand A. Kulkarni , Ramesh Subramanian , Edward R. Roesch , Rod Waits , Roberto Schupbach , John R. Fraley , Alexander B. Lostetter , Brice McPherson , Bryon Western
- Applicant: David J. Mitchell , Anand A. Kulkarni , Ramesh Subramanian , Edward R. Roesch , Rod Waits , Roberto Schupbach , John R. Fraley , Alexander B. Lostetter , Brice McPherson , Bryon Western
- Applicant Address: US FL Orlando US AR Fayetteville
- Assignee: Siemens Energy, Inc.,Arkansas Power Electronics International, Inc.
- Current Assignee: Siemens Energy, Inc.,Arkansas Power Electronics International, Inc.
- Current Assignee Address: US FL Orlando US AR Fayetteville
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
A circuit assembly (34) affixed to a moving part (20) of a turbine for receiving information about a condition of the part and transmitting this information external to the engine. The circuit assembly includes a high-temperature resistant package (34A) that attaches to the part. A high temperature resistant PC board (42) supports both active and passive components of the circuit, wherein a first group of the passive components are fabricated with zero temperature coefficient of resistance and a second group of the passive components are fabricated with a positive temperature coefficient of resistance. The active components are fabricated with high temperature metallization. Connectors (40) attached to the PC board pass through a wall of the package (34A) for communication with sensors (30) on the part and with an antenna (26) for transmitting data about the condition of the part to outside the turbine.
Public/Granted literature
- US20100039289A1 Wireless Telemetry Electronic Circuit Package for High Temperature Environments Public/Granted day:2010-02-18
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