Invention Grant
- Patent Title: Solderless connector assembly
- Patent Title (中): 无焊接接头组件
-
Application No.: US12965736Application Date: 2010-12-10
-
Publication No.: US08221134B2Publication Date: 2012-07-17
- Inventor: Harold Daniel Dove
- Applicant: Harold Daniel Dove
- Applicant Address: US CA Garden Grove
- Assignee: Basic Electronics, Inc.
- Current Assignee: Basic Electronics, Inc.
- Current Assignee Address: US CA Garden Grove
- Agency: Stetina Brunda Garred & Brucker
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A connector assembly is provided for communicating electrical signals between a pin connector having a plurality of connector pins and a remote location. The assembly comprises a connector defining a connector top surface and a plurality of pins extending therethrough, the pins each defining a pin contact surface extending above the connector top surface less than 0.1 inches. A collar is engaged about the connector body, the collar having an upper surface substantially coplanar with the connector top surface. A flexible cable has a plurality of electrical connectors extending therethrough, the cable defining a plurality of cable contact pads being in electrical communication with the flexible cable conductors. A retaining member is engageable to the collar for urging the flexible cable contact pads into electrical communication with the pin contact surfaces.
Public/Granted literature
- US20120149230A1 SOLDERLESS CONNECTOR ASSEMBLY Public/Granted day:2012-06-14
Information query