Invention Grant
- Patent Title: Connector assembly having grounding means
- Patent Title (中): 具有接地装置的连接器组件
-
Application No.: US12968299Application Date: 2010-12-15
-
Publication No.: US08221160B2Publication Date: 2012-07-17
- Inventor: Heng Liu , Xian-Kui Shi , Chung-Yen Yang
- Applicant: Heng Liu , Xian-Kui Shi , Chung-Yen Yang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
- Priority: CN200920317447 20091215
- Main IPC: H01R13/60
- IPC: H01R13/60

Abstract:
A connector assembly (100) includes an insulative cover (11, 12) defining an interior and an exterior, and the insulative cover having at least one platform (18) disposed outside of the interior thereof; a printed circuit board (3) located in the interior of the insulative cover; at least one connector (2) mounted to the printed circuit board; and a conductive member (4) fixed to the insulative cover, said conductive member (4) including a main body (41), an arm (42) extending forwardly from the main body and a spring finger (43) formed at a front edge of the arm, the main body supported by the platform, the spring finger contacting the printed circuit board.
Public/Granted literature
- US20110143593A1 CONNECTOR ASSEMBLY HAVING GROUNDING MEANS Public/Granted day:2011-06-16
Information query