Invention Grant
- Patent Title: Polishing apparatus for polishing a work having two surfaces
- Patent Title (中): 用于抛光具有两个表面的工件的抛光装置
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Application No.: US12155118Application Date: 2008-05-29
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Publication No.: US08221198B2Publication Date: 2012-07-17
- Inventor: Fumihiko Tokukra , Mitsuo Takeuchi
- Applicant: Fumihiko Tokukra , Mitsuo Takeuchi
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2007-208398 20070809
- Main IPC: B24B41/06
- IPC: B24B41/06
Abstract:
A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a carrier having a hole configured to house the work, and a fixing member that contacts and fixes the work located in the hole.
Public/Granted literature
- US20090075574A1 Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method Public/Granted day:2009-03-19
Information query
