Invention Grant
- Patent Title: Percutaneous spinal implants and methods
- Patent Title (中): 经皮脊髓植入物和方法
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Application No.: US11928424Application Date: 2007-10-30
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Publication No.: US08221458B2Publication Date: 2012-07-17
- Inventor: Hugues F. Malandain , Avram Allan Edidin
- Applicant: Hugues F. Malandain , Avram Allan Edidin
- Applicant Address: CH Neuchatel
- Assignee: Kyphon Sarl
- Current Assignee: Kyphon Sarl
- Current Assignee Address: CH Neuchatel
- Main IPC: A61B17/88
- IPC: A61B17/88

Abstract:
A method includes moving a spinal implant such that a central portion of the spinal implant is disposed between adjacent spinous processes, radially extending a proximal portion of the spinal implant on a first side of the adjacent spinous processes such that movement of the proximal portion between the adjacent spinous processes is inhibited, and radially extending a distal portion of the spinal implant on a second side of the adjacent spinous processes opposite the first side such that movement of the distal portion between the adjacent spinous processes is inhibited.
Public/Granted literature
- US20080058935A1 PERCUTANEOUS SPINAL IMPLANTS AND METHODS Public/Granted day:2008-03-06
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