Invention Grant
- Patent Title: Nitride semiconductor substrate and method for forming the same
- Patent Title (中): 氮化物半导体衬底及其形成方法
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Application No.: US12177167Application Date: 2008-07-22
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Publication No.: US08221547B2Publication Date: 2012-07-17
- Inventor: Po-Chun Liu , Yih-Der Guo , Tung-Wei Chi , Chu-Li Chao
- Applicant: Po-Chun Liu , Yih-Der Guo , Tung-Wei Chi , Chu-Li Chao
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW97116197A 20080502
- Main IPC: B32B3/10
- IPC: B32B3/10 ; C30B25/04

Abstract:
An initial substrate structure for forming a nitride semiconductor substrate is provided. The initial substrate structure includes a substrate, a patterned epitaxial layer, and a mask layer. The patterned epitaxial layer is located on the substrate and is formed by a plurality of pillars. The mask layer is located over the substrate and covers a part of the patterned epitaxial layer. The mask layer includes a plurality of sticks and there is a space between the sticks. The space exposes a portion of an upper surface of the patterned epitaxial layer.
Public/Granted literature
- US20090274883A1 NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR FORMING THE SAME Public/Granted day:2009-11-05
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