Invention Grant
- Patent Title: Process for the production of packaging material for electronic component cases
- Patent Title (中): 电子元件包装材料生产工艺
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Application No.: US11913422Application Date: 2006-04-28
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Publication No.: US08221576B2Publication Date: 2012-07-17
- Inventor: Hiroshi Hata
- Applicant: Hiroshi Hata
- Applicant Address: JP Isehara-shi
- Assignee: Showa Denko Packaging Co.
- Current Assignee: Showa Denko Packaging Co.
- Current Assignee Address: JP Isehara-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-133817 20050502
- International Application: PCT/JP2006/308993 WO 20060428
- International Announcement: WO2006/118251 WO 20061109
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00

Abstract:
The production method of the present invention is characterized by comprising a temporary bonding step of temporarily bonding a first sheet comprising a thermoplastic resin non-oriented film layer and a thermoplastic adhesive resin layer laminated on one surface of the thermoplastic resin non-oriented film layer and a second sheet comprising a heat resistant resin oriented film layer and an aluminum foil layer laminated on one surface of the heat resistant resin oriented film layer by passing the first sheet and the second sheet between a pair of rolls in a state in which the thermoplastic adhesive resin layer and the aluminum foil layer are brought into contact with each other to press them while heating in a state in which the thermoplastic adhesive resin does not melt to thereby obtain a pre-laminated sheet, and a complete bonding step of integrally bonding the first sheet and the second sheet by heating the pre-laminated sheet to melt the thermoplastic adhesive resin. This production method can attain a reduced plant cost and high speed production.
Public/Granted literature
- US20090258173A1 PROCESS AND EQUIPMENT FOR THE PRODUCTION OF PACKAGING MATERIAL FOR ELECTRONIC COMPONENT CASES Public/Granted day:2009-10-15
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