Invention Grant
- Patent Title: System for plating
- Patent Title (中): 电镀系统
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Application No.: US11560719Application Date: 2006-11-16
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Publication No.: US08221598B2Publication Date: 2012-07-17
- Inventor: Wolfgang Diel , Richard M. Peekema , Murali Ramasubramanian
- Applicant: Wolfgang Diel , Richard M. Peekema , Murali Ramasubramanian
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Zilka-Kotab, PC
- Main IPC: C25D17/12
- IPC: C25D17/12
Abstract:
A system for plating according to one embodiment includes a plating cell containing plating solution; an anode in contact with the plating solution; a cathode in contact with the plating solution; and a hydrogen electrode in contact with the plating solution.
Public/Granted literature
- US20070068801A1 SYSTEM FOR PLATING Public/Granted day:2007-03-29
Information query
